MEMS Technologies and Applications

32. Chemnitzer Seminar
  • Wann 21.06.2019 bis 22.06.2019 (Europe/Berlin / UTC200)
  • Wo Chemnitz
  • Name des Kontakts
  • Web Externe Webseite besuchen
  • Termin zum Kalender hinzufügen iCal

Programm

Dienstag, 21. Mai 2019

12:30 - 12:40 Uhr pm Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
12:40 - 1:10 Uhr pm

Keynote: Trends and Challenges in MEMS Integration
Emilie Jolivet, Yole Développement

1:10 - 1:40 Uhr pm MEMS based Photo-Acoustic Gas Sensor
Dr. Rainer Schaller, InfineonTechnologies AG
1:40 - 2:10 Uhr pm Advanced Surface Micromachining Process – a First Step towards 3D MEMS
Dr. Jörg Bräuer, Robert Bosch GmbH
2:10 - 2:50 Uhr pm Poster and Demonstrator Presentation, Coffee Break and Networking
2:50 - 3:20 Uhr pm Keynote: Quality and Reliability Testing of Wirebonds – Limitations and  new Opportunities
Stefan Schmitz, Bond-IQ GmbH
3:20 - 3:50 Uhr pm Organic and Flexible Sensors in Applications
Dr. Dominik Gronarz, Organic Electronics Saxony Management GmbH
3:50 - 4:20 Uhr pm Capacitive Micromachined Ultrasonic Transducers for Medical and Non- Medical Applications
Dr. Nooshin Saeidi, Fraunhofer ENAS
4:20 - 4:50 Uhr pm Transferring Research Knowledge to Clinical Practice – Challenges and Chances
Dr. Marcus Binner, TissueGUARDTeam

Mittwoch, 22. Mai 2019

8:30 -  8:40 Uhr am Welcome
Dr. Maik Wiemer, Fraunhofer ENAS
8:40 -  9:10 Uhr am

Keynote: From Sampling to Ramping – Technology and Business Model Challenges for MEMS Foundries to Address WLP Applications
Volker Herbig, X-FAB Semiconductor Foundries AG 

9:10 - 9:40 Uhr am Sensor Development for Space Applications – Challenges and Opportunities
Robin Schmidt, Jena- Optronik GmbH
9:40 - 10:10 Uhr am Wafer-Level Ag-Ag Thermocompression Bonding and Its Evaluation
Prof. Jörg Frömel, Tohoku University
10:10 - 10:40 Uhr am Poster and Demonstrator Presentation, Coffee Break and Networking
10:40 - 11:10 Uhr am Keynote: Huawei R&D – Areas of Interest, Cooperation Models and Best Practices
Dr. Andrea Sanfilippo, Huawei Europe
11:10 - 11:40 Uhr am Current Funding Opportunities in Electronics and MEMS
Dr. Gregor Schwartz, VDI/VDE Innovation + Technik GmbH
11:40 - 12:10 Uhr pm 3D Printed Electronics for Mechatronic Systems
Dr. Martin Hedges, Neotech AMT GmbH
12:10 - 12:40 Uhr pm Building-in Reliability into Power Modules
Dr. Jacek Rudzki, Danfoss Silicon Power GmbH
12:40 - 1:40 Uhr pm Lunch
1:40 - 2:10 Uhr pm Electrodeposition of Aluminum Towards Wafer-Level Al- l Thermocompression Bonding
Silvia Hertel, Fraunhofer ENAS
2:10 - 2:40 Uhr pm Discussion and End of Workshop
from 2:40 Uhr pm Individual Lab and Window Tours